Different componets available in optisystem

Again, Surface mount packaging also uses ceramic or plastic molding. This, in turn, results in making it extremely important to detect the failure in the entire process. This is because of the miniaturization of components and also because they are mounted extremely close to each other. Although this process of fabrication helps do things quickly, it also increases the chances of defects. Surface mount packaging follows the technology of mounting or placing the components directly on the printed circuit board surface. This one usually suits a multi-pin packaging. The pins are arranged vertically from the body and can be placed on a grid. Pin Grid Array (PGA) in the lead pitch is 2.54 mm, and the body is made out of ceramics. Also, the sealing material used in this is glass. Other types of through holed packages include CER-DIP in which the lead pitch is 2.54mm and the body is molded with ceramics.

This sort of packaging was short-lived and was mainly used in dynamic RAM chips. These pins are perpendicularly aligned in the package and closer to each other. Zig-Zag in Line Packages (ZIP) - The pins in this kind of a package are inserted perpendicularly to the circuit board. Smaller in size, they use high pin density packaging. Shrink - Similar to the standard ones but the lead pitch is 1.778 mm. Skinny - In this packaging, the space between the terminal rows is 7.62mm. Standard - This is the most common packaging. There are many types of DIP Packages, Plastic Dual In-Line Package ( PDIP) and Molded Dual In-Line Package ( MDIP) are the few popular types. These pins are placed in a manner that they can be adjusted on to the center of a breadboard without short-circuiting each other or even get smoldered into PCBs. The pins are spaced at 0.1 inches.Р”Р‡urthermore, the package varies in size due to the difference in the number of pins in different packages. Just like in 28-pin ATmega328, the pins are placed in parallel to each other extending perpendicularly and laid out on a black plastic housing which is rectangular in shape. These are the most significantly used IC packages is Dual Inline Packages (DIP). To add on to that classification, Through-hole mount packages come in ceramic and plastic types. These are majorly used in electronic equipment to compensate for the board space and cost limitations.Р”Вual inline packages are one of the examples of through-hole mount packages. They are bigger in size as compared to the other kind. They are designed in a way that the lead pins are stuck through one side of the board and soldered on the other. The packages are classified into two kinds on the basis of how they are mounted on a circuit board. Diffusion: A diffusion step following ion implantation is used to anneal bombardment-induced lattice defects. The ionized particles are accelerated through an electrical field and targeted at the semiconductor wafer.Р”В§. Ion Implantation: The most widely used technique to introduce dopant impurities into the semiconductor. Oxidation: In the oxidation process, oxygen (dry oxidation) or H O (wet oxidation) molecules convert silicon layers on top of the wafer to silicon dioxide.Р”В¦. Chemical Mechanical Polishing - A planarization technique by applying a chemical slurry with etchant agents to the wafer surface.Р”Тђ. Deposition - By the method of Physical Vapor deposition and chemical vapor deposition, materials are applied on the wafer.Р”В¤. Etching - The unwanted materials are removed from the surface of the wafer.Р”Р€. Later, light is projected through a reticle containing mask information and it is selectively removed.Р”Сћ.

Lithography - It is a process to define a pattern wherein a photoresist material is uniformly applied on the wafer surface and then baked to harden. The IC manufacturing Steps are as follows-Р”РЋ. As a matter of fact, ICs consist of monolithic, hybrid, or film circuits. In this article, we will learn about the different IC package types and where they can be useful.Р”В«efore we dive into the different types of IC packages, let's quickly learn about the IC fabrication process. Today almost all components are available in two or more different types of packages among which the engineer can select the one which suits his application best. Manufacturers are constantly working to shrink the size of ICs, and furthermore, multiple components are also being gradually integrated into LSI, VLSI, and ULSI designs to reduce the number of components on board.

From bulky vacuum tubes to compact SMD ICs, there has been a lot of transition in the way electronics components appeared or packaged.

Different componets available in optisystem